NEW DELHI : India will soon announce a 40 nanometre (nm) semiconductor fabrication unit and multiple compound fab proposals under the modified semiconductor investment scheme, minister of state for electronics and IT Rajeev Chandrasekhar said. “We will certainly have, very soon, an announcement of a 40nm silicon fab. We will also have multiple compound fab proposals," Chandrasekhar said in an interview.
Chips will roll out from the fab within two to three years of the announcement, he added. “These are not decisions running from election cycle to election cycle. These are decisions for the next decade.
We will be in a position this calendar year to take the decision on the 40nm fab, and none of these decisions will be taken in a hurry," he added. The minister did not spell out the identities of the companies that have submitted proposals. The new proposals come after the government modified its $10 billion financial incentive scheme to support the building of semiconductor, packaging, testing, and allied fabrication units in India, accepting proposals for mature nodes, or above 40nm, without a deadline.
Vedanta Foxconn Pvt. Ltd has also applied under the modified scheme, but after the two split up and decided to apply for the scheme separately, the proposal is likely to stay with Vedanta or be replaced by a fresh one from Vedanta, Chandrasekhar said. He noted that the legal entity that applied continues to remain, and any equity changes were not relevant to the proposal.
Read more on livemint.com