Micron broke ground for its $2.75-billion (Rs 22,854 crore) chip packaging plant at Sanand in Gujarat on Saturday, marking a significant milestone in India’s goal to emerge as a hub for global semiconductor manufacturing.
The Idaho-headquartered company, which had announced its intent to invest in India during Prime Minister Narendra Modi’s trip to the US in June, received a fast-track approval for its proposal, becoming the first overseas company to commence construction under the ambitious $10-billion India Semiconductor Mission.
“The entire global semiconductor industry is feeling very confident about India now,” union IT and electronics minister Ashwini Vaishnaw told ET at the ground-breaking ceremony. “We should see at least two large proposals in the coming few months, which will establish India as a (manufacturing) leader in some of the niche semiconductor products,” he said.
Tata Projects will lead construction in the plant’s first phase, which entails building 500,000 square feet of planned cleanroom space, said Micron vice-president Gursharan Singh.
The US company expects to begin construction of phase II in the second half of the decade, which will be similar in scale to the current project. In all, the project will directly generate some 5,000 new jobs and spur the creation of around 15,000 additional jobs in the larger community over the next several years, according to company estimates.
Terming