semiconductor design linked incentive scheme (DLI) to include bigger Indian as well as foreign companies, the minister of state for electronics and information technology Rajeev Chandrasekhar said. Speaking to reporters on the sidelines of the Semicon 2023 event in Gandhinagar, Gujarat, Chandrasekhar said that so far seven startups had been selected as participants in the semiconductor DLI scheme. “This initiative is steadily gaining confidence and support.
It is a relatively new opportunity for startups to delve into deep tech and semiconductor design. We are envisaging that the programme should eventually include larger companies as well,” Chandrasekhar said. Apart from the five startups selected earlier, the ministry of electronics and information technology has also selected Chennai-based Aheesa Digital Innovations and Bengaluru-based Calligo Technologies as participants in the semiconductor DLI scheme.
While Aheesa focuses on telecom, networking, and cyber security domains, Calligo focuses on serving global companies in big data as well as artificial intelligence and machine learning systems. A memorandum of understanding was signed between the centre for nano science and engineering and US’ Lam Research India to develop specialised courses for Indian universities was also signed in the presence of Chandrasekhar here on Saturday. These courses, he said, would help develop the right kind of talent in India, which in turn will help companies hire from the country.
“Some of these students can be sent to intern with global semiconductor chip companies or foundries for a semester or two. Others can also explore virtual simulation of working in global chip labs and foundries,” he said. On Saturday, the Centre for
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