‘India must take leadership role in advance packaging of semiconductors’
leadership role in the industry. Edited excerpts from the interview: Modi: We have a presence in India for over 35 years, with a workforce across design centres in Noida, Bengaluru, Ahmedabad and Pune . One third of our staff of 11,000 is in India, including 30% of research and development team.
We are engaged in collaborations, discussions with institutions such as ministry of electronics and information technology and the design-linked incentive programme. We see three key avenues for collaboration that align with India’s ambition to become a prominent global player in semiconductors. First is about cultivating a robust cloud-based ecosystem for design.
Second and pivotal area is advanced packaging, more specifically what we refer to as 3D-IC and chiplet. Third is the support of generative AI technologies. India has huge opportunity to leverage it in enabling workforce.
Modi: The trend within the overall ecosystem involves a shift from monolithic chips to modular chips, driven by the growing complexity and size of chips. This involves disaggregating System on Chip designs into discrete chips representing heterogenous functions and then integrating it together with advanced packaging. The movement to 3D-IC is fast gaining momentum but is still in relatively early days and presents a very strong opportunity for India to assume a leadership role in this industry transition, similar to skipping broad landline deployment to go directly to mobile phones.
Cadence has strong collaborations with leading foundries like TSMC and Samsung to provide certified reference for its Integrity platform. By participating in global standards and becoming a 3D-IC and chiplet hub, India can carve out key role in this area. Modi: We’re
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