'Semiconductor packaging unit in Assam’
₹25,000 crore semiconductor packaging plant which will be established in partnership with the Assam government and Tata Group, minister of state for electronics and IT Rajeev Chandrasekhar said at the Future Skills Summit in Guwahati, on Thursday. “A semiconductor packaging plant will be established in partnership with the Assam government and Tata Group. We will soon obtain all approvals and submit it to the cabinet for final approval.
Young Indians aspiring to enter the world of semiconductors won’t have to leave their state or travel to other cities anymore," the minister said at the event. The minister’s statement follows a prior announcement by chief minister Himanta Biswa Sarma on a packaging unit coming to the state. The government has earmarked ₹76,000 crore as a financial assistance scheme to attract semiconductor fabrication and packaging units to come up in the country.
The first investment under the scheme has been done by US-based Micron Technology, which has begun setting up its ATMP unit in Sanand, Gujarat. The plant will entail an investment of $2.75 billion, $800 million of which will be pumped in by Micron and the rest split between central and state governments. The first packaged chip from the unit is expected by December 2024.
Tata Group would be eligible for the subsidies as well as and when they apply for it, central government officials said. The Indian government’s $10-billion financial assistance plan for establishing semiconductor fabrication units and allied services has several suitors. The government has approved US-based Micron Technology Inc.’s plans for setting up a testing and packaging unit in Gujarat, which is already under way.
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