Tata Electronics Ltd has started exporting limited quantities of semiconductor chips packaged at a pilot line at its Bengaluru-based research and development centre, people familiar with the matter told ET.
These packaged chips are being shipped to some of Tata Electronics' partners in Japan, the US and Europe, the people said. This comes as the Tata group company lays the groundwork for its new chip packaging unit at Morigaon in Assam and a $10 billion chip foundry at Dholera in Gujarat.
“Tata Electronics has packaged chips there which they are sending to customers right now outside the country. They have multiple partners and are expanding their customer base. Some of these (products) are still in the pilot stage,” one of the persons cited above told ET.
A second person said the company is also in near final stages for a successful tape-out of semiconductor chips in 28, 40, 55, 65 nm (nanometre), and some other higher nodes. A tape-out refers to the final result of the designing process for integrated circuits or printed circuit boards before they are sent for manufacturing.
“There are multiple rounds before a successful tape-out. So, some of these products will be in advanced stages of R&D and they will be sent to select customers to